S70FS01GS Bulk Erase (0xFE command)

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Anonymous
Not applicable

Hello,

I would like to bulk erase the complete memory ( i.e. both the devices FS512S).

Since I am pretty new to this Flash memory , I would like to know if anything should be configured before i use the command?

Could I know the steps if Configuration of the lower or Upper address is necessary before bulk erase?

If so could I know the steps to achieve Bulk erase?

Regards,

Edwin

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1 Solution
Apurva_S
Moderator
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100 likes received 500 replies posted 250 solutions authored

Hi Edwin,

If you want to perform Bulk Erase operation on S70FS01GS, it will be a two step process. You will have to erase one die at a time.

  • For erasing the lower die the command sequence should be -

     CS# LOW

     WREN command (06h)

     CS# HIGH

     CS# LOW

     BEA command (FEh)

     Any address from lower die (say 0x0000000)

     CS# HIGH

  • For erasing the upper die the command sequence should be -

     CS# LOW

     WREN command (06h)

     CS# HIGH

     CS# LOW

     BEA command (FEh)

     Any address from upper die (say 07FFFFFFh)

     CS# HIGH

Typically, it will take 220 seconds to erase one die, but the maximum bulk erase time can go up to 720 seconds.

Thanks and Regards,

Apurva

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3 Replies
Apurva_S
Moderator
Moderator
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100 likes received 500 replies posted 250 solutions authored

Hi Edwin,

Thank you for contacting Cypress Community.

For S25FS512S -

Since this is a single die chip, the only thing that should be kept in mind before using the Bulk Erase command is that any kind of block protection should be disabled. That is, all the Block Protection bits (BP2, BP1, BP0) should be set to zero. Before the Bulk Erase command can be accepted by the device, a WREN command should be issued to the device.

For S70FS01GS -

This is a dual die stack of two S25FS512S chips. The Bulk Erase (BE 60h or C7h) command is not supported by S70FS01GS. For S70FS01GS, Bulk Erase is performed one chip at a time since there is a single Chip Select signal.

The Bulk Erase Addressed (BEA FEh) command is used for S70FS01GS chips.

For erasing the upper die, a WREN command should be issued first, followed by the BEA command and any address of the upper die.

For erasing the lower die, a WREN command should be issued first, followed by the BEA command and any address of the lower die.

This two step process will erase the entire S70FS01GS chip.

Block Protection should be disabled. (That is, Block Protection (BP2, BP1, BP0) bits should be set to zero.)

Here is a link to the datasheet for S70FS01GS - http://www.cypress.com/file/215911/download

You can go to section "9.6.4 Bulk Erase Addressed" on page 98 for the explanation.

If you have any further queries, please feel free to ask.

Thanks and Regards,

Apurva

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Anonymous
Not applicable

Hi Apurva,

thanks for the quick response.

if I have to erase both the die i.e. upper and lower

If I am write you mean this ?

lower die: address : 0x0000000 - 03FFFFFFh ?

upper die: address : 0x04000000h - 07FFFFFFh?

Erasing each die says 220 - 720 secs max?

Regards,

Edwin

0 Likes
Apurva_S
Moderator
Moderator
Moderator
100 likes received 500 replies posted 250 solutions authored

Hi Edwin,

If you want to perform Bulk Erase operation on S70FS01GS, it will be a two step process. You will have to erase one die at a time.

  • For erasing the lower die the command sequence should be -

     CS# LOW

     WREN command (06h)

     CS# HIGH

     CS# LOW

     BEA command (FEh)

     Any address from lower die (say 0x0000000)

     CS# HIGH

  • For erasing the upper die the command sequence should be -

     CS# LOW

     WREN command (06h)

     CS# HIGH

     CS# LOW

     BEA command (FEh)

     Any address from upper die (say 07FFFFFFh)

     CS# HIGH

Typically, it will take 220 seconds to erase one die, but the maximum bulk erase time can go up to 720 seconds.

Thanks and Regards,

Apurva