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Hello,
I refer the AN79938 Design Guidelines for Cypress Ball Grid Array (BGA) Packaged Devices (Document No. 001-79938 Rev. *E).
Is the S70GL02GT11FHB010 64-FBGA (13 x 11mm, 0.6mm ball diameter) package Solder Mask Defined or Non-Solder Mask Defined openings?
Could you provide the recommended Solder Ball Pad Design for S70GL02GT11FHB010?
Best Regards,
Naoaki Morimoto
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Hello Morimoto-san,
In regards to the S70GL02GT11FHB010 64-FBGA (13mm x 11mm, 0.6mm ball diameter) package, Cypress offers solder mask defined (SMD) pad on the package side. However, Cypress recommends NSMD configuration for PCB land pad design for most applications,
as the NSMD configuration results in a stronger bond between the solder pad and the ball.
URL to AN202751 - Surface Mount Assembly Recommendations for Cypress FBGA Packages :
http://www.cypress.com/file/202451/download
URL to AN99178 - Solder Mask and Trace Recommendations for FBGAs :
http://www.cypress.com/file/202531/download
Hope this helps...
Thank you and regards,
Albert
Cypress Applications Support
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Hello Morimoto San,
Please refer the application note below provides guidelines on surface mount assembly for Cypress's Fine Pitch Ball Grid Array (FBGA) packages, printed circuit board (PCB) design :
http://www.cypress.com/file/202451/download
Thanks,
Krishna.
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Hello Morimoto-san,
In regards to the S70GL02GT11FHB010 64-FBGA (13mm x 11mm, 0.6mm ball diameter) package, Cypress offers solder mask defined (SMD) pad on the package side. However, Cypress recommends NSMD configuration for PCB land pad design for most applications,
as the NSMD configuration results in a stronger bond between the solder pad and the ball.
URL to AN202751 - Surface Mount Assembly Recommendations for Cypress FBGA Packages :
http://www.cypress.com/file/202451/download
URL to AN99178 - Solder Mask and Trace Recommendations for FBGAs :
http://www.cypress.com/file/202531/download
Hope this helps...
Thank you and regards,
Albert
Cypress Applications Support