3 Replies Latest reply on Sep 10, 2020 12:19 PM by ApurvaS_36

    S25FL-S device capacity, pkg options and reliability

    PhPu_4560846

      Latest info show S25FL-S supporting 512Mb and 1Gb capacity. That's great.

      • Are both new devices 100% compatible to the earlier 128/256Mb devices in terms of command, function and compatible with Xilinx ZYNQ 7000 drivers?
      • How are the die arranged in the 512Mb and 1Gb in the package?
      • Are they equally reliable in terms die mechanical and thermal reliability?
      • Can these devices come in WSON package same as S25FL256SAGNFM000 so we can upgrade our board?
      • How do I order samples w/ WSON pkg?
        • 1. Re: S25FL-S device capacity, pkg options and reliability
          ApurvaS_36

          Hi,

           

          Thank you for contacting Cypress Community.

           

          [Q] Are both new devices 100% compatible to the earlier 128/256Mb devices in terms of command, function and compatible with Xilinx ZYNQ 7000 drivers?

          [A] Yes, 512Mb and 1Gb devices are 100% compatible with 256/128Mb devices in terms of command and function. The only difference with 1Gb part is that it has 2 CS# lines as it is a dual die stack of two 512Mb devices. Yes, all the four devices are compatible with Xilinx ZYNQ 7000.

           

          [Q] How are the die arranged in the 512Mb and 1Gb in the package?

          [A] I'm sorry I didn't understand your question. Can you please elaborate?

           

          [Q] Are they equally reliable in terms die mechanical and thermal reliability?

          [A] Checking on this internally.

           

          [Q] Can these devices come in WSON package same as S25FL256SAGNFM000 so we can upgrade our board?

          [A] Unfortunately, 512Mb/1Gb parts are not available in WSON package. You can check the available package options in the 'Ordering Information' section of the datasheet. Link - S25FL512S, S70FL01GS.

           

          Thank you and Regards,

          Apurva

           

          • 2. Re: S25FL-S device capacity, pkg options and reliability
            PhPu_4560846
            • The dual stack die arrangement answered my question.
            • Please share feedback on reliability when available

             

            Thank you Apurva.

            • 3. Re: S25FL-S device capacity, pkg options and reliability
              ApurvaS_36

              Hi,

               

              Apologies for the delay.

              You can refer to one of the MCP report (002-21614) for the reliability test performed on MCP package.

              Typically, we perform qualification separately for MCP package due to different construction.

              Let me know if this answers your question or you need more information.

               

              Thank you and Regards,

              Apurva