No, the issue is with soldering the Ni Pd Au , there are no issues with bake out, the coupons cards as I know are not showing moisture. I have made a request to the assembly team to confirm but moisture ingress was not reported into the packaging.
Moisture would cause issues with the device package when soldered. This is strictly a wetting issue with the NiPdAu lead finish.
Senior Test Engineer, Design Support Team
BAE Systems Electronic Systems, Controls & Avionics Solutions
4250 Airport Expy., Fort Wayne, Indiana 46809 United States