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Well, I managed to find the Cypress equivalent of the Freescale/NXP document on WLCSP requirements! It was not easy though (I had to follow a bread-crumb trail from older documents that hinted that such a thing existed, even though it ended up having a very different name now). Here it is:
"AN69061 - Design, Manufacturing, and Handling Guidelines for Cypress Wafer Level Chip Scale Packages".
It has all the information needed to design the PCB. I also found this note from Mentor-Graphics that has a lot of information:
And apparently there is a tool called "PCB Libraries" that has an "IPC-7351 Calculator" that will generate the industry standard right sized pads based on your input about the package and layout technique you want to use (NSMD vs. SMD). I haven't tried it myself, but they say there are free versions.
Anyway, I think I have my answer sufficient that I can generate my own footprint now and have it agree with industry standards (IPC-7351 apparently... a "pay for play" document unfortunately).
Reading your question, I also tried to find one.
But with my ability I could not.
You've done a great job!