You can calculate maximum operating junction temperature of our devices using below formula -
Tj = Theta Ja * P + Ta
Tj: Junction temperature
Theta Ja: Junction to ambient thermal resistance
P: Power consumption of the device (VCC (max) * ICC (max)).
Ta: Ambient temperature
Please see Theta Ja value for the requested device below -
Theta Ja: 39 °C/W
Maximum power dissipation: VCC(max) * ICC (max)
You can consider the Icc(max) value from the datasheet depending upon the operation being performed with the device.
Please let me know if you have any further queries.
To get a more realistic power dissipation from the memory consider the dynamic power consumption when the memory chip is driving the IO. dynamic power = 0.5*C*V^2*F*No of IOs Total power is static+ dynamic. Below document has details. https://www.cypress.com/documentation/application-notes/an4017-understanding-temperature-specifications-introduction