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Hi,
Would like to know more about the device structure of CY15B104Q F-RAM.
Is it a 2 die or single die IC?
What process is used for the die/dies ? (e.g. TI's 130nm , IBM 180nm , etc. )
Is it structurally similar to FM25W256 /FM33256?
Thanks.
Regards,
SX Pang
Solved! Go to Solution.
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Hi,
The CY15B104Q is a single die device and uses the TI's 130 nm technology. The FRAM parts have the same memory cell composed of the same material so in that sense they have same structure.
Thanks,
Pradipta.
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Hi,
The CY15B104Q is a single die device and uses the TI's 130 nm technology. The FRAM parts have the same memory cell composed of the same material so in that sense they have same structure.
Thanks,
Pradipta.
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Hi Pradipta,
Well understood.
Thanks for the information.
Regards,
SX Pang