Thank you for contacting Cypress Semiconductor.
The solder spheres cannot be repaired after the soldering process, but rather, the solder spheres will need to be replaced. In other words, the entire BGA package will need to be re-balled.
I would like to suggest you to consult with a certified assembly house equipped to re-ball BGA packages, using Pb-Free material.
Thank you for your prompt reply.
I understood it .
Please tell me.
Do you mean that The assembly house is Third party?
I would like to inform you that there is no Cypress certification required for any assembly house to re-ball BGA packages. However, the assembly house should have BGA re-ball capability. The S29AL016J datasheet should have package solder ball dimensions for the 48-ball BGA (VBK-048) package. Therefore, you may approach any third-party assembly house to re-ball the 48-ball BGA (VBK-048) package, provided that the assembly house has full BGA re-ball capability.