1 Reply Latest reply on Jun 7, 2019 6:45 AM by GyanC_36

    PSOC4 BLE WLCSP underfill material review


      Our customer want to do underfill process in their PCB, could you help confirm the material is OK or not.

      1.     Zymet X2821 ?
      2.     Fuji UF317H ?


      If not, could you provide the recommend underfill material.



        • 1. Re: PSOC4 BLE WLCSP underfill material review

          We has not verified the Underfill process for this module.

          The provided materials, we do not have the data, but seeing from the rough description, the first one, flow-ability seems too high, the PCB edge area maybe cannot be filled well. The second one, it’s UV curing process, the gap area under the PCB cannot be cured well.

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