1 Reply Latest reply on Jun 7, 2019 6:45 AM by GyanC_36

    PSOC4 BLE WLCSP underfill material review

    BrKu_1344346

      Our customer want to do underfill process in their PCB, could you help confirm the material is OK or not.

      1.     Zymet X2821 ?
      2.     Fuji UF317H ?

       

      If not, could you provide the recommend underfill material.

       

      Brian

        • 1. Re: PSOC4 BLE WLCSP underfill material review
          GyanC_36

          We has not verified the Underfill process for this module.

          The provided materials, we do not have the data, but seeing from the rough description, the first one, flow-ability seems too high, the PCB edge area maybe cannot be filled well. The second one, it’s UV curing process, the gap area under the PCB cannot be cured well.

          1 of 1 people found this helpful