Layout: Keep-out areas with multiple PCBs stacked closely?

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Anonymous
Not applicable

Suppose I have a design using a BCM20736S SIP that's made up of two PCBs stacked closely on top of each other with approximately 2mm of air between them.  The SIP would reside on the top-most PCB and the ground plane rules stated in the datasheets will be followed as closely as possible.  However, the PCB directly beneath it has a continuous ground plane without any keep-out areas.  How significant of an effect will this have on RF performance?

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Anonymous
Not applicable

Hello Andrew,

 

It will affect the RF performance for sure.

This design would be similar to a design where a customer put a coin cell battery right underneath the 20736S and they couldn’t get more than 10m of range.

Does this answer your question?

JT

 

  This shorter range may be OK for a wearable design.

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Anonymous
Not applicable

Hello Andrew,

 

It will affect the RF performance for sure.

This design would be similar to a design where a customer put a coin cell battery right underneath the 20736S and they couldn’t get more than 10m of range.

Does this answer your question?

JT

 

  This shorter range may be OK for a wearable design.

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