1 Reply Latest reply on May 8, 2015 12:16 PM by jota_1939431

    Layout: Keep-out areas with multiple PCBs stacked closely?

      Suppose I have a design using a BCM20736S SIP that's made up of two PCBs stacked closely on top of each other with approximately 2mm of air between them.  The SIP would reside on the top-most PCB and the ground plane rules stated in the datasheets will be followed as closely as possible.  However, the PCB directly beneath it has a continuous ground plane without any keep-out areas.  How significant of an effect will this have on RF performance?