Not sure if this is the right thread, anyway... I have to replace a BCM43455 integrated chip from a mobile circuit board, and i want to know how many air flow heat can i apply to remove the chip without damaging it, the air flow speed recommended, finally, what is the maximum exposure time for that?
Thanks in advance.
Here is a link to the general Cypress guideline for soldering. https://www.cypress.com/documentation/other-resources/cypress-reflow-profile
I will get back to you if there are any specific requirements for BCM/CYW43455.