5 Replies Latest reply on Apr 28, 2015 9:22 PM by ankr_1205151

    Pin bonding clarification for the SIP (BCM2073xS)

      The following is posted under the blog post, BCM2073XS GPIO Basics

       

      The following GPIOs are available on the BCM2073XS based SIP Modules (remember, only 14 are brought out on the SIP module, so many of these are shared):

       

      • P8/P33 (Dual bonded, only one of two is available.)
      • P13/P28 (Dual bonded, only one of two is available.)
      • P14/P38 (Dual bonded, only one of two is available.)
      • P12/P26 (Dual bonded, only one of two is available.)
        - P12 if not used as P26 or external 32KHz LPO; If used as 32KHz LPO, then P12 and P26 are unavailable
      • P11/P27 (Dual bonded, only one of two is available.)
        -P11 if not used as P27 or external 32KHz LPO; If used as 32KHz LPO, then P11 and P27 are unavailable

       



      According to the Pin Assignments listed in the datasheet for the SIP, P8/P33 are *not* dual bonded.  In addition to this, P12/P26 aren't dual-bonded either.  This is only appears to be true for the SoC, not the SIP.


      Questions: 


      1) Is it possible to use both P8 and P33 simultaneously using the SIP?

      2) Is it possible to use P12 and P26 simultaneously using the SIP?

      3) If a 32kHz LPO is implemented using the SIP, is P26 still unavailable, even though according to the datasheet it's not bonded with P12?