What the meaning of the label on the surface of chip S29GL128P10TFI01

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huqic_3861581
Level 2
Level 2

The label on the surface of chip S29GL128P10TFI01 is S29GL128P10TFI01 706FF309C@05 SPANSION. What does the numbers and letters of 706FF309C@05 SPANSION meaning? Thanks

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AlbertB_56
Moderator
Moderator
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500 replies posted 50 likes received 250 replies posted

Hello Qiaopeng,

Thank you for contacting Cypress Semiconductor

The meaning of the "706FF309 C   C05 Spansion" are as follows :

"7" = 2017 production year

"06" = Workweek tf when the device was packaged within 2017 production year

"F" = Package Assembly Location  (Japan)

"F" = Mark and Pack Location  (Japan)

"306" = 306th wafer lot sequence within the workweek 06

"C" = For Cypress Internal Tracking Purposes only; Transparent to the end user.

"05" = 2005 is the year the circuitry was Copyrighted

"Spansion" = the S29GL128P10TFI01 was originally design and manufactured by Spansion.

                       Cypress acquired Spansion in March, 2015.

Hope this helps...

Best regards,

Albert

Cypress Semiconductor

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3 Replies
AlbertB_56
Moderator
Moderator
Moderator
500 replies posted 50 likes received 250 replies posted

Hello Qiaopeng,

Thank you for contacting Cypress Semiconductor

The meaning of the "706FF309 C   C05 Spansion" are as follows :

"7" = 2017 production year

"06" = Workweek tf when the device was packaged within 2017 production year

"F" = Package Assembly Location  (Japan)

"F" = Mark and Pack Location  (Japan)

"306" = 306th wafer lot sequence within the workweek 06

"C" = For Cypress Internal Tracking Purposes only; Transparent to the end user.

"05" = 2005 is the year the circuitry was Copyrighted

"Spansion" = the S29GL128P10TFI01 was originally design and manufactured by Spansion.

                       Cypress acquired Spansion in March, 2015.

Hope this helps...

Best regards,

Albert

Cypress Semiconductor

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Hello Albert,

   Thank you very much for your wonderful answer, but I have another questions to ask.

   Sum up. Faulty flash chip surface label are S29GL128P10TF101 706FF309C @05 SPANSION and S29GL128P10TF101

722FF163C @05 SPANSION, and the total number is 18pcs. Have you ever received any feedback about the problems in these two batches before? Or is there a problem with these two batches in the production process?

  Below picture one is the power-on waveform of VIO and VCC. Below picture two  is the power-down waveform of VIO and VCC. VCC and VIO are connected together. The voltage amplitude is 3.3V. Thank you !

Best regards,

Qiaopeng Hu

Accelink company, China

qiaopeng.hu@accelink.com

3V3_UP.png

                                                        picture 1

3V3_DOWN.png

                                                        picture 2

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huqic_3861581
Level 2
Level 2

Hi Albert

  Are you sure FF means Japan? Not Malaysia?thanks

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