3 Replies Latest reply on Jan 3, 2019 11:32 PM by huqic_3861581

    What the meaning of the label on the surface of chip S29GL128P10TFI01

    huqic_3861581

      The label on the surface of chip S29GL128P10TFI01 is S29GL128P10TFI01 706FF309C@05 SPANSION. What does the numbers and letters of 706FF309C@05 SPANSION meaning? Thanks

        • 1. Re: What the meaning of the label on the surface of chip S29GL128P10TFI01
          AlbertB_56

          Hello Qiaopeng,

           

          Thank you for contacting Cypress Semiconductor

           

          The meaning of the "706FF309 C   C05 Spansion" are as follows :

          "7" = 2017 production year

          "06" = Workweek tf when the device was packaged within 2017 production year

          "F" = Package Assembly Location  (Japan)

          "F" = Mark and Pack Location  (Japan)

          "306" = 306th wafer lot sequence within the workweek 06

          "C" = For Cypress Internal Tracking Purposes only; Transparent to the end user.

           

          "05" = 2005 is the year the circuitry was Copyrighted

          "Spansion" = the S29GL128P10TFI01 was originally design and manufactured by Spansion.

                                 Cypress acquired Spansion in March, 2015.

           

          Hope this helps...

           

           

          Best regards,

          Albert

          Cypress Semiconductor

          • 2. Re: What the meaning of the label on the surface of chip S29GL128P10TFI01
            huqic_3861581

            Hello Albert,

               Thank you very much for your wonderful answer, but I have another questions to ask.

               Sum up. Faulty flash chip surface label are S29GL128P10TF101 706FF309C @05 SPANSION and S29GL128P10TF101

            722FF163C @05 SPANSION, and the total number is 18pcs. Have you ever received any feedback about the problems in these two batches before? Or is there a problem with these two batches in the production process?

              Below picture one is the power-on waveform of VIO and VCC. Below picture two  is the power-down waveform of VIO and VCC. VCC and VIO are connected together. The voltage amplitude is 3.3V. Thank you !

            Best regards,

            Qiaopeng Hu

            Accelink company, China

            qiaopeng.hu@accelink.com

            3V3_UP.png

                                                                    picture 1

            3V3_DOWN.png

                                                                    picture 2

            • 3. Re: What the meaning of the label on the surface of chip S29GL128P10TFI01
              huqic_3861581

              Hi Albert

                Are you sure FF means Japan? Not Malaysia?thanks