I'm designing PCB for custom board using BCM20737S.
Then I have to make the board as small as possible and want radio wave to propagate over about 20 meters.
So, basically I think that the top of PCB abides by the recommended layout in CYW20737S Bluetooth Low Energy SiP Module Technical Reference.
However, I couldn't understand whether the the Keep-Out area showed in Technical Reference also includes others (i.e. bottom layer) or not.
If it includes other layers, perhaps I can't keep the recommendation layout.
In that case, please give me some advice to make board as smaller with keeping radio wave as strong as possible.