1 Reply Latest reply on Apr 20, 2015 3:47 AM by BoonT_56

    About Keep-Out Area


      I'm designing PCB for custom board using BCM20737S.

      Then I have to make the board as small as possible and want radio wave to propagate over about 20 meters.

      So, basically I think that the top of PCB abides by the recommended layout in CYW20737S Bluetooth Low Energy SiP Module Technical Reference.

      However, I couldn't understand whether the the Keep-Out area showed in Technical Reference also includes others (i.e. bottom layer) or not.


      If it includes other layers, perhaps I can't keep the recommendation layout.

      In that case, please give me some advice to make board as smaller with keeping radio wave as strong as possible.