This is discussion is regarding part no: CYW54907KWBGT (WICED™ IEEE 802.11 a/b/g/n/ac SoC with an Embedded Applications Processor).
As per the datasheet (http://webinr.keysight.com//Docs/202/88/02/CYW54907_WICED_IEEE_802.11_a_b_g_n_ac_SoC_with_an_Embedded_Applications_Proce… ), the package for this part is 4.583 mm x 5.533 mm, 316-pin WLCSP. But there is no information regarding ball/pin placement in the datasheet.
Please provide us detailed physical drawing for this part.
Also, I was checking CYW954907AEVAL1F Evaluation Kit (http://www.cypress.com/documentation/development-kitsboards/cyw954907aeval1f-evaluation-kit ) for this part. As per the gerber and schematic of this part. The package size is 10 mm X 10 mm with 136 pins).
Please confirm the part size and number for this part?
Thanks & Regards,
As per the datasheet of CYW54907 (http://www.cypress.com/file/407801/download), we provide part number CYW54907KWBG with package 4.583 mm x 5.533 mm, 316-pin WLCSP.
The schematics of the evaluation kit shows the dimension of the module LBWA1UZ1PS-241 (given at the bottom) (10mm x 10mm) containing CYW54907 chip.