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<<<Small difference in packaging only.
Which supposedly results in easier manufacturing of boards using 43438 over those using 4343W. (I think I recall 43438 having one extra ball/pad being used ; I might be able to find that info if you need it)
Thank you both for pointing out the general differences.
In addition to different physical packages (CYW4343W available in 74-ball, 63-ball and 153-bump; CYW43438 available in only 63-ball), I now see:
CYW4343W has up to 16 GPIO pins, four additional BT_GPIO pins (BT_GPIO_2 thru BT_GPIO_5) and an Analog BT_AGPIO pin.
CYW43438 appears to only have three GPIO pins (if you don't count BT_GPIO_0 and BT_GPIO_1).
In the 63-WLBGA package, the CYW4343W has 11 additional signals brought out:
- BT_GPIO_3 @ F4
- BT_GPIO_4 @ G5
- BT_GPIO_5 @ H5
- BT_I2S_CLK @ A4
- BT_I2S_DO @ B3
- BT_I2S_WS @ A3
- GPIO_3 @ K4
- GPIO_4 @ K5
- SYS_VDDIO @ C5
- WPT_1P8 @ D5
- WPT_3P3 @ E5
Extra GPIOs, Extra communication port, Extra VDDIO input and a couple don't connect pins.
I believe you are citing chip level implementation details specified in the SoC datasheet for each part.
Module partner implementations of each could vary. Do you have a customer that is looking to move between the two devices and wants to know the tradeoffs between module partner implementations? My understanding is that the two are functionally identical with slight packaging changes.
I know within the SDK both share the 43438 firmware.