At first, a thermal pad dimensions should NOT ideally be less than 5 mm x 5mm.
As comply with this rule, you can prevent unreliable operation of the chip.
If you use 5 mm x 5 mm pad, the 6 mm x 6 mm pattern of the thermal vias will not change since it will be removed the extra part of the pad from around vias itself.
This will ensure that the dimensions of the thermal pad are reduced while maintaining the thermal vias pattern.
Hello Takayama san,
CY7C65213-32LTXI has a 3.5mm x 3.5mm thermal pad.
Is the recommended vias for this size 3x3 array or 2x2 array?