Dear Team, We are using S29AL008J55TFIR10 NOR Flash in one of our board design. we have to do the thermal analysis of PCB Board. so for this we required thermal parameter of all parts used in this design. We did not found thermal parameter (RθJA, Rθ

[Anonymous]

Dear Team,

We are using S29AL008J55TFIR10 NOR Flash in one of our board design.

we have to do the thermal analysis of PCB Board. so for this we required thermal parameter of all parts used in this design.

We did not found thermal parameter (RθJA, RθJC, RθJB) info of S29AL008J55TFIR10 this part in the respective datasheet.

so requesting the community to provide this parameters.

RθJA,

RθJC

RθJB

Thanks & regards,

Divya

[Anonymous · Accepted solution]

Hi,

S29AL008J55TFIR10 (TS048 package) has a junction to ambient thermal resistance (Theta JA or θja) of 40 °C/W.

We do not provide theta JC and theta JB thermal resistance values for our flash products. We usually give psi JT and theta JA parameters which provides a meaningful method to predict junction temperature in plastic package devices.

The psi JT value is 17 C/W.

You can find this value (theta JA and psi JT) in the device qualification report page 2 available at:

http://www.cypress.com/s29al008j-reliability-report

Also, for your reference, please find our application note "Thermal Considerations and Parameters" available at:

http://www.cypress.com/documentation/application-notes/an201006-thermal-considerations-and-parameter...

It explains  why theta JC and theta JB values are not good approximations for plastic packages. I hope this application note is helpful for you.

Thanks,

Nada