Hello Morimoto San,
Please refer the application note below provides guidelines on surface mount assembly for Cypress's Fine Pitch Ball Grid Array (FBGA) packages, printed circuit board (PCB) design :
In regards to the S70GL02GT11FHB010 64-FBGA (13mm x 11mm, 0.6mm ball diameter) package, Cypress offers solder mask defined (SMD) pad on the package side. However, Cypress recommends NSMD configuration for PCB land pad design for most applications,
as the NSMD configuration results in a stronger bond between the solder pad and the ball.
URL to AN202751 - Surface Mount Assembly Recommendations for Cypress FBGA Packages :
URL to AN99178 - Solder Mask and Trace Recommendations for FBGAs :
Hope this helps...
Thank you and regards,
Cypress Applications Support