2 Replies Latest reply on Dec 5, 2017 9:48 AM by AlbertB_56

    64-FBGA Pad Opening Details




      I refer the AN79938 Design Guidelines for Cypress Ball Grid Array (BGA) Packaged Devices (Document No. 001-79938 Rev. *E).

      Is the S70GL02GT11FHB010 64-FBGA (13 x 11mm, 0.6mm ball diameter) package Solder Mask Defined or Non-Solder Mask Defined openings?

      Could you provide the recommended Solder Ball Pad Design for S70GL02GT11FHB010?


      Best Regards,

      Naoaki Morimoto