I want package (QFN or QFP) too.
Because it is impossible with other packages to mount on a self-made board.
We do have plans to support TQFP, QFN, and lower ball count CSPs. You will start to see these packages Q2 2019.
Thanks for the question and let me know if you have any others.
Sounds really good with QFN, will make things much easier!
While waiting for the QFN, I'm struggeling trying to make a PSOC6 design with that 116pin BGA. Do you have any information on how to make good fanouts for that BGA and suggestions on PCB manufacturers that can handle it for low quantity protottype production with reasonable yield?