What is the recommended pad size for the FX3S BGA footprint? (pad diameter)
Currently I am using 0.45mm diameter in my designs - is this suitable (given that the balls on the package are 0.3mm diameter)?
The recommended pad size for FX3 BGA is 0.241 mm (9.5 mil). You can find the same information in the following application note under "FX3 Device Package Dimensions" section.
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