I will use the flash S25FL128SAGN as the FPGA configration chip. It isn't offen operated on the board.
The flash is 8-contact WSON package with a big exposed thermal pad .But there is no enough space to soldering the thermal pad . So the thermal pad isn't soldered, It's OK?
Thank you for your reply!
It is OK to leave the thermal pad on the 8 contact WSON package not soldered. It has no internal connections, it just adds structural integrity when soldered to the board but is not absolutely required.
Thanks and Regards,