1 Reply Latest reply on Dec 18, 2016 9:43 PM by Gyan Chand

    Do I need to remove bonding if the bonding central more than 4?

    cgh21_1497191

      Since the OTA need bonding, So I add bonding to my project,and the security setting:mode1, no input no output, unauthenticated paring with encryption. But I found if the central more than 4, than the latest central seems can not bond to my peripheral, so my question is do I need to remove bonded central if the 5th central want to bond to it? I think the SDK will automatically remove the oldest central.

         

      I use cybl10463 and BLE component version 3.10. 

        • 1. Re: Do I need to remove bonding if the bonding central more than 4?
          Gyan Chand

          Hi,

             

          Currently our chips support maximum 4 bonded devices.

             

          So,if central wants to bond 5th device ,you need to remove the bonding information of one of any bonded device.SDK wont be able remove the bonding information automatically.

             

          You can use following API to do so.

             

          1)CyBle_GapRemoveBondedDevice(CYBLE_GAP_BD_ADDR_T *bdAddr).................Any device of your choice.

             

          2)CyBle_GapRemoveOldestDeviceFromBondedList().............Remove the oldest device bonding information.

             

           

             

          Regards,

             

          Gyan

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