Indeed, i have seen that. It does not however talk about landing patterns for the BGA. For example pad size in mils or via and drill size in mils. If cypress had an example design that would also help. I am not aware of any. The general rule of thumb is 17% smaller pads than ball diameter however I have no idea for vias.
Page 42 of the same document shows the ball size: 0.260+- 0.03
It also lists the dimensions/specifications of the 76-BGA WLCSP package.
It also lists: Reference JEDEC publication 95, Design Guide 4.18
I don't see any references to vias explicitly.