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Over-compressed lead frame . Is there a guideline of acceptance ?
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Sensing Technologies
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Thanks for the phones. My suggestion to have this addressed are:
1) Contact the place where you ordered the device.
2) Get help from Cypress/Infineon quality team by opening a "Product Quality" mycase on https://www.cypress.com/mycases
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Do you mean that you have some chips which might have the "Over-compressed lead frame" issue?
Can you elaborate a little bit more about the question?
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Hi
these are the findings please help to advise
1 side of sample is shown to not have entire leadframe shown on side and below are the photos depicting the issue ( refer to photo 1)
Mold instrusion at edge, suspect due to over compression of leadframe. refer to photo 2
Bottom view (terminal pad) of affected pin: unusual shape ( refer to photo 3)
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Thanks for the phones. My suggestion to have this addressed are:
1) Contact the place where you ordered the device.
2) Get help from Cypress/Infineon quality team by opening a "Product Quality" mycase on https://www.cypress.com/mycases