Strictly necessary cookies are on by default and cannot be turned off. Functional, Performance and Tracking/targeting/sharing cookies can be turned on below based on your preferences (this banner will remain available for you to accept cookies). You may change your cookie settings by deleting cookies from your browser. Then this banner will appear again. You can learn more details about cookies HERE.
Strictly necessary (always on)
Functional, Performance and Tracking/targeting/sharing (default off)
The BCM2073x chip (SoC) has 40 logical GPIOs (P0-P39).The GPIOs themselves are broken out into three separate ports (meaningful when you start program...
The BCM2073x chip (SoC) has 40 logical GPIOs (P0-P39).
The GPIOs themselves are broken out into three separate ports (meaningful when you start programming):
• P0 through P15 on port0
• P16 through P31 on port1
• P32 through P39 on port2
The 32 pin package (i.e. the SoC - BCM20736 and BCM20737 *without* the S) only brings out 14 of the 40 logical GPIOs. The System in Package/SIP (the BCM20736S and BCM20737S modules) follows the SoC closely with regards to which pins are brought out (but there is a slight difference) and these are what you see in the SIP module datasheets.
Since the 32 pin package (SoC) and the modules are pin-limited, some of the logical GPIOs within the SoC are multi-bonded before bringing them out on the balls on the chip.
For the 32 pin package, the following pins are bonded in this manner:
P8 and P33 (only one of two is available)
P11 and P27 (only one of two is available)
P12 and P26 (only one of two is available)
P13 and P28 (only one of two is available)
P14 and P38 (only one of two is available)
Very Important Note: The SOC packaged part described above is not used for the SIP module. The SIP uses the raw die and wirebonds it differently than the DFN part, so the IOs described above for the SoC are not bonded together from the die - they are bonded together on the DFN wirebond package.
When leveraging the WICED™ Smart Hardware Interfaces for your development, you will run across several GPIO mapping tables in the document that look like this one:
Note here that you can use only one of the GPIOs (noted in black) from each of the vertical rows above. This is what is referenced in the WICED™ Smart Hardware Interfaces as a "group" (all signals must be selected from the same group, which is essentially the table).
All options may not be available in the package used within the SIP module (shown in red). Combinations shown in red text are also not generally available on the BCM20732 TAG. Additional options may be unavailable if they are being used for the peripheral UART interface.
All GPIOs support programmable pull-up and pull-down resistors, along with a 2 mA drive strength except P26, P27, and P28, which provide a 16 mA drive strength at 3.3V supply (this will change as the supply drops and the GPIO pins will sink less current).
The GPIOs are all capable of waking the device from sleep or deep sleep and the application can configure interrupts (both/either edges, level), pull-up/pull-down High-Z, etc.
The following GPIOs are available on the BCM2073XS based SIP Modules (remember, only 14 are brought out on the SIP module):
P8/P33 (Dual bonded, only one of two is available) Change per information received on 4/28/15: our packaging facility confirmed that P8 and P33 are both available and that on the SIP they are not dual-bonded
P13/P28 (Dual bonded, only one of two is available)
P14/P38 (Dual bonded, only one of two is available)
P12/P26 (Dual bonded, only one of two is available) Change per information received on 4/28/15: our packaging facility confirmed that P12 and P26 are both available and that on the SIP they are not dual-bonded - P12 if not used as P26 or external 32KHz LPO; If used as 32KHz LPO, then P12 and P26 are unavailable - If external 32KHz OSC is used then P12 is not available, but P26 is available
P11/P27 (Dual bonded, only one of two is available) -P11 if not used as P27 or external 32KHz LPO; If used as 32KHz LPO, then P11 and P27 are unavailable - If external 32KHz OSC is used then P11 is not available, but P27 is available
For unused dual bonded pins, the unused GPIO should be input/output disabled (especially when it is an input).
From the perspective of writing software against the GPIO mappings defined above, it's important to keep in mind that the GPIO is physically mapped to a BCM2073XS device within the platform.h file which is custom to the TAG development board by default.
However, this mapping in platform.h can be reconfigured for a custom design.
The values in platform.h then map to definitions and function prototypes in bleprofile.h
Note that the specific values in the bleprofile.h bitmasks themselves are not intended to be exposed as the code beneath these bitmasks is proprietary and cannot be released for reasons outside the scope of this discussion.
In addition to reconfiguring the mappings of your custom board within the bleprofile.h, GPIO can also be assigned within BLE_PROFILE_GPIO_CFG within the .c file for each application. This is also where you allocate/initialize the GPIO within your application. The bleprofile_xxx() routines are then how you use/access what you have configured above.
With this said, I realize there is some ambiguity in this message as we have documents like WICED™ Smart Hardware Interfaces which clearly states that the BCM2073X (note that this guide was written for the SoC, then modified slightly for the SIP module) includes two sets of APIs that are available for the application: the low-level driver API and the high-level profile API.
So yes, the Low Level API is there and in some cases ok to use, but we are not consistent in exposing everything a developer needs to actually use it effectively on a consistent basis.
Hopefully you guys find this helpful. I know many of you have tidbits to add, so feel free to comment (please stay on topic). I would love to see some examples and code snippets showing usage of the bleprofile_xxx() routines.
RevisionDescriptionDate1.0I2C Description10/27/14The I2C topics seem to be a bit confusing.I am creating this Blog to address these concerns.I will po...
The I2C topics seem to be a bit confusing.
I am creating this Blog to address these concerns.
I will post a video shortly that will thru a Code Walk Thru.
There is a known issue with i2cm_* functions.
You must use cfa_* functions instead.
i2cm_* can only be used when patch enable_spiff1_i2c_interop.a is used *and* NV is serial flash on SPI1
Here are miscellaneous notes that have collected regarding the I2C Issues:
Both SCL and SDA should be high before I2C communication begins.
SPIFFY1 is shared with I2C, which is already being used to talk to the EEPROM on the module.
SPI-flash and I2C interfaces concurrent:
We don’t have the drive strength once to drive the I2C line hard enough with a total of 4 slaves on the bus.
How the SDA pin is sampled during boot by the firmware and how the I2C pins behave:
Connecting SDA to Vdd/Vio to recover is probably a bad idea
SCL and SDA are both open-drain
The pull-ups pull the signal high while the HW drives it low
It never drives high, but floats the output pad leaving the pull-up to pull the line high
If you put a scope to either of these lines on the board when the FW accesses these, high to low transitions will be very sharp while low to high transitions will be pretty slow due to the intrinsic RC
If you connect SCL/SDA to Vdd, then when the HW block drives SDA low, there will be a direct short (though momentary) between Vdd and GND - Not good
This will happen pretty early during boot because the ROM always uses 0xA0 as the slave address of the EEPROM and you can see that there are repeated 0s in this sequence (and the shorts) which could do bad things to the supply or the chip
Shorting to GND on the other hand, is safer because that is what happens when there is a 0 bit on the bus and there is a 10K pull-up which will limit the current to something within the max ratings of all components on this line
How to decrease the clock speed during programming (and for subsequent accesses to the EEPROM), because the faster clock speed seems to be causing another i2c device to lock up:
See i2cm.h, i2cm_setSpeed(). Use I2CM_SPEED_* from this header.
If you use cfa_* API that is used by the i2c_temperature_sensor sample, you cannot change the I2C bus speed (defaults to 400KHz). You can use the corresponding API in i2cm.h to read/write the same data and also change speed if required
I2C and P_UART Dependency:
PUART and I2C don't have any dependency. You can use both at the same time. SPI2 and PUART however do have some restrictions, see the datasheet or the HW interfaces document (in short - PUART RX and SI2 have to be on the same GPO bank).
I2C and SPI1 share GPIOs. With SDK 2.1 and above, there is an optional patch with which you can use I2C when SPI1 is used for NV storage (serial flash). But the other way where you want to use SPI1 as an SPI master when using I2C EPROM slave is not possible.
To use it, you just have to include the patch and use the API in i2cm.h:
If you are having problems with your installer, check that the download size of the installer is roughly 260MB, installer problems are typically caused by incomplete downloads.
The picture below shows a very common error message. Our SDK utilizes a 32-bit version of an Eclipse based IDE which requires a 32-bit version of JRE to be installed. If you already have the 64-bit JRE installed, you will also need to install the 32-bit version as well. The JRE is designed to allow both 32 and 64 bit variants to be installed on the system.
The WICED Sense kit uses a Silicon Labs USB to Serial Device. The TAG3 board uses an FTDI USB to Serial Device. Both should be installed as part of the SDK 2.2.1 installation process. If not, the FTDI drivers for the TAG3 reinstall them using the file /WICED-Smart-SDK/Drivers/dpinst.exe (make sure you access from the command line). The Silicon Labs USB Drivers can be foundWICED Sense Table of Contents
Everything we have for the WICED Sense, such as schematics, drivers, and Android application source code, can be accessed through theWICED Sense Table of Contents. A great post for the WICED Sense is theWICED SENSE Kit BLOGwhich is like a WICED Sense quick start guide.
Some Android devices appear to have issues pairing to the WICED Sense Tag from inside the app, linked is a work-around that should allow you to connect to your Android device:WICED Sense Android Pairing Work-Around