PSOC6 BLE CY8C6347BZI-BLD54 124-BGA underfill material

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seli_1640621
Level 1
Level 1
Distributor - Zenitron(GC)
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Our customer want to do underfill process (CY8C6347BZI-BLD54 124-BGA) in their PCB.
Could you provide the recommend underfill material.


Thank you.

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1 Solution
Yugandhar
Moderator
Moderator
Moderator
500 solutions authored 1000 replies posted 5 likes given

 

Hello,

Please find the few parts numbers from Henkel. It depends on requirements on choosing the part number it needs to be validated on board to ensure requirements are meet and process for mass production accordingly.

Henkel are one of supplier who are manufacturer of under filling material.

https://dm.henkel-dam.com/is/content/henkel/lt-8332-brochure-board-level-underfills-and-encapsulants

 

Yugandhar_0-1626360157582.png

Conventional underfill materials come in one- and two-part formulations, and deciding whether a one- or two-part is appropriate depends on:

i. Curing temperature and time requirements.

ii. Viscosity limitation.

iii. Chemical resistance.

It is important to consider the different use cases for reworkable versus non-reworkable underfill materials.

go-to application method for underfills is Capillary underfill, and it can be arranged in three ways:

  • Full Underfill

Yugandhar_1-1626360157588.png

 

  • Edge Bonding

Yugandhar_2-1626360157595.png

 

  • Corner Stake

Yugandhar_3-1626360157600.png

 

Thanks,

P Yugandhar.

View solution in original post

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1 Reply
Yugandhar
Moderator
Moderator
Moderator
500 solutions authored 1000 replies posted 5 likes given

 

Hello,

Please find the few parts numbers from Henkel. It depends on requirements on choosing the part number it needs to be validated on board to ensure requirements are meet and process for mass production accordingly.

Henkel are one of supplier who are manufacturer of under filling material.

https://dm.henkel-dam.com/is/content/henkel/lt-8332-brochure-board-level-underfills-and-encapsulants

 

Yugandhar_0-1626360157582.png

Conventional underfill materials come in one- and two-part formulations, and deciding whether a one- or two-part is appropriate depends on:

i. Curing temperature and time requirements.

ii. Viscosity limitation.

iii. Chemical resistance.

It is important to consider the different use cases for reworkable versus non-reworkable underfill materials.

go-to application method for underfills is Capillary underfill, and it can be arranged in three ways:

  • Full Underfill

Yugandhar_1-1626360157588.png

 

  • Edge Bonding

Yugandhar_2-1626360157595.png

 

  • Corner Stake

Yugandhar_3-1626360157600.png

 

Thanks,

P Yugandhar.

0 Likes