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Our customer want to do underfill process (CY8C6347BZI-BLD54 124-BGA) in their PCB.
Could you provide the recommend underfill material.
Thank you.
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Hello,
Please find the few parts numbers from Henkel. It depends on requirements on choosing the part number it needs to be validated on board to ensure requirements are meet and process for mass production accordingly.
Henkel are one of supplier who are manufacturer of under filling material.
https://dm.henkel-dam.com/is/content/henkel/lt-8332-brochure-board-level-underfills-and-encapsulants
Conventional underfill materials come in one- and two-part formulations, and deciding whether a one- or two-part is appropriate depends on:
i. Curing temperature and time requirements.
ii. Viscosity limitation.
iii. Chemical resistance.
It is important to consider the different use cases for reworkable versus non-reworkable underfill materials.
go-to application method for underfills is Capillary underfill, and it can be arranged in three ways:
- Full Underfill
- Edge Bonding
- Corner Stake
Thanks,
P Yugandhar.
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Hello,
Please find the few parts numbers from Henkel. It depends on requirements on choosing the part number it needs to be validated on board to ensure requirements are meet and process for mass production accordingly.
Henkel are one of supplier who are manufacturer of under filling material.
https://dm.henkel-dam.com/is/content/henkel/lt-8332-brochure-board-level-underfills-and-encapsulants
Conventional underfill materials come in one- and two-part formulations, and deciding whether a one- or two-part is appropriate depends on:
i. Curing temperature and time requirements.
ii. Viscosity limitation.
iii. Chemical resistance.
It is important to consider the different use cases for reworkable versus non-reworkable underfill materials.
go-to application method for underfills is Capillary underfill, and it can be arranged in three ways:
- Full Underfill
- Edge Bonding
- Corner Stake
Thanks,
P Yugandhar.