Current issue is our chip can only store 4 devices to bond, so we have a FIFO (first in first out) buffer to remove old bonding. Problem is when a device that was bonded and removed comes back to be rebonded will not prompt the PSOC part to generate new bonding as the device still has the key....while the PSOC part threw out it's key. Anyone know any work arounds or any idea's on how to improve this. The current fix is to manually remove the bonding information on the device, then try to reconnect to the PSOC part which will be successful. If you don't remove the bonding, you will make a gatt connection, but since you are not bonded you don't have read/write permissions.
