PTNに基づき、後継品の評価において。
従来型格:S29GL064N90TFI030
Migraton to:S29GL064S70TFI030
EOL置換評価において、後継品は、書込みに3倍程度時間が掛かるとの指摘を受けました。
0.65nm(Automatic ECC)品においては、具体的に3倍かどうかは別にして、
従来より書込み時間がかかる、は回避できない事象でしょうか?
あるいは、回避アドバイスがありましたら、教えて下さい。
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I had an issue with the 4READ command.
Data is output one clock later than expected.
It seems that the change_addr signal is to blame: it fires depending on the ADS bit at 24 or32 bit boundary.
For commands configurable between 3/4 byte addresses this is correct, but i.m.o. 4READ always is 4 byte address,
so change_addr should always fire at32 bit boundary.
Please check whether assumption above is correct.
Regards, Wim
My code mod to remove issue:
IF (current_state /= STANDBY) AND
(Instruct /= WRR) AND (Instruct /= WRAR) THEN
IF ((Instruct = READ) AND to_nat(WRR_reg_in) = 0) OR Instruct /= READ THEN
-- IF ADS = '1' AND address_cnt = 32 THEN
IF address_cnt = 32 THEN
change_addr <= '1', '0' AFTER 1 ns;
ELSIF ADS = '0' AND address_cnt = 24 THEN
change_addr <= '1', '0' AFTER 1 ns;
END IF;
END IF;
Hi,
the datasheet states an Erase Endurance of 1000 cycles and a Data Retention of 100 years after 10000 cycles.
Does that mean that the device can endure 10000 Program/Erase cycles without degradation or damage?
On what conditions is the limit of 1000 cycles based?
Thanks
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Hey Cypress,
We are using S29GL256S90GHI010 with 56-ball VBU056 LF package on our design.
Can you please provide us the thermal resistance (junction to ambient) for this package?
In addition, can you please note what is the maximum temperature allowed on the junction of a voltaged (working) device?
Adiel
Show LessDo you have Tj(max) specification for below parts?
- S25FL064LABMFB010 (Ta=105degC)
I calcurated the Tj = 112degC by other community answers. (Θja=65.8, Pdiss(max)=0.108W (=30mA*3.6V)).
But I think this value is not Tj (max).
We expect the Tj(max)=125degC
Thank you.
Show LessDear Sir or Madam,
I'm looking for BIS model for S29GL01GS11FHI010.
Could you let me know where will I find it, please?
Best Regards,
Fukaya
Show LessWe are using the Flash memory S25FL256SAGMFV01 in our system for storing data logs , whenever we do sector erase we are facing the reset happening in the system,
kindly someone please provide help
Show LessDo we have the Single event upset rate or cross section for this part:S25FL512SAGMFA011-? Single event latchup rate?what is the process technology(nm) of this device? Any details will be
Show LessHello,
Customers are considering replacing Micron's NOR-Flash (PC28F512M29EWL) with S29GL512S10FHI020.
At the Micron's footprint, F7 is defined as #BYTE, and the current board inputs 3.3V directly to the F7 pin.
The F7 pin of S29GL512S10FHI020 is defined as RFU. Does the IC work even if 3.3V is input here?
(RFU is described as not currently connected internally in the datasheet)
I understand that the recommended processing of RFU pins is unconnected and not used for PCB routing.
However, since the board cannot be changed in time, I would like to replace NOR Flash without changing the circuit.
If E7pin is used for other purposes in the future, can customers receive notifications such as PCN?
Micron's datasheet
https://media-www.micron.com/-/media/client/global/documents/products/data-sheet/nor-flash/parallel/m29ew/m29ew_256mb_2gb.pdf?rev=8b0ce4778c8f4fe3a83ea294c499c3bc
Best Regards,
Naoaki Morimoto
Show LessUsing device S29GL01GT12DHVV10. Trying to use the device ID and noticed the data sheets for S29GL01GT and S29GL01GS appear to have the same device IDs, even though they are built on different process nodes. Is it correct that they have the same device IDs? Please confirm the correct device ID for S29GL01GT12.
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