What is the material composition of S25FL-S Flash in a 24-BGA?

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GrCa_1363456
Level 6
Level 6
50 likes received Beta tester First comment on KBA

I'm specifically looking for pin composition of an S25FL512SAGBHIA13 24-BGA Flash.

I found several potential locations that could describe the SAC (or Tin, Gold, Copper, Nickel, Palladium....) content - but nothing definitive.

References:

- S25FL512SAGBHIA13 webpage @ https://www.cypress.com/part/s25fl512sagbhia13 has link to PIN203403 describing material of the tape on a reel used to transport the BGAs.

- Quality Packaging site has many BGA and FBGA packages in the results, but none for 24-pin 6x8 mm https://www.cypress.com/packaging

- 24-BGA(8.0x 6.0 x 1.0mm)Pb-Free Package, PACKAGE MATERIAL DECLARATION DATASHEET @ https://www.cypress.com/file/327201/download is an undated document that describes Cypress Package Code ELA024, which I couldn't trace back to S25FL-S

- QTP# 153701: New Package Qualification of the BKK 24 FBGA, with CuPd, KMC-3580LVA, CRM-1577DB, SAC 305, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4 @ https://www.cypress.com/documentation/qualification-reports/qtp-153701-new-package-qualification-bkk... is a November 2015 document describing a 24-FBGA. This could be the correct document, not sure how to link it back to S25FL-S

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1 Solution
AlbertB_56
Moderator
Moderator
Moderator
500 replies posted 50 likes received 250 replies posted

Hello,

Thank you for contacting Cypress Semiconductor.

The Ordering Part Number (OPN) "S25FL512SAGBHIA13"  indicates  ("B") a  the 24-ball  5 x 5 config. , BGA footprint with RESET# and VIO.  The Material Set ("H") indicates Halogen Free and Pb-Free.  the actual material composition is SAC-305 (Sn = 96.5%;  Ag = 3.0%;  Cu = 0.5%)

 

Hope this helps...

 

 

Best regards,

Albert

Cypress Semiconductor Corp

An Infineon Technologies Company

View solution in original post

1 Reply
AlbertB_56
Moderator
Moderator
Moderator
500 replies posted 50 likes received 250 replies posted

Hello,

Thank you for contacting Cypress Semiconductor.

The Ordering Part Number (OPN) "S25FL512SAGBHIA13"  indicates  ("B") a  the 24-ball  5 x 5 config. , BGA footprint with RESET# and VIO.  The Material Set ("H") indicates Halogen Free and Pb-Free.  the actual material composition is SAC-305 (Sn = 96.5%;  Ag = 3.0%;  Cu = 0.5%)

 

Hope this helps...

 

 

Best regards,

Albert

Cypress Semiconductor Corp

An Infineon Technologies Company