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Hello,
I have probed address line 25 and 26 to see it toggle between bank 0-3. I am able to write erase and see the device ID up to sector address 3FF0000H which shows the first flash in the block diagram, yet when I try to write anything above or even read device ID above, I cannot read any device id, is there a algorithm or something that chooses which flash block it uses besides bit 26 and 25 on the pin side?
Thanks,
George M.
Solved! Go to Solution.
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Hello,
Thank you for contacting Cypress Technical Support, an Infineon Technologies Company.
S70GL02GT is a dual-die device with single CE# (i.e., CE# on two dies are tied together internally). A26 is used to distinguish the two dies. To access the 2nd die, all the addresses need to have A26=1. For example, program data into the 2nd die, all the command cycles (including Unlock1, Unlock2, Program command, Program data) need to have A26=1.
We don't understand what you mean by bank 0-3. S70GL02GT contains two GL01GT dies. Each GL01GT is a single bank device. So at any given time, only one embedded operation (e.g., programming, erasing etc.) is allowed on one die.
Thank you
Regards,
Bushra
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Hello,
Thank you for contacting Cypress Technical Support, an Infineon Technologies Company.
S70GL02GT is a dual-die device with single CE# (i.e., CE# on two dies are tied together internally). A26 is used to distinguish the two dies. To access the 2nd die, all the addresses need to have A26=1. For example, program data into the 2nd die, all the command cycles (including Unlock1, Unlock2, Program command, Program data) need to have A26=1.
We don't understand what you mean by bank 0-3. S70GL02GT contains two GL01GT dies. Each GL01GT is a single bank device. So at any given time, only one embedded operation (e.g., programming, erasing etc.) is allowed on one die.
Thank you
Regards,
Bushra
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Hello,
Appologies, I understand this has answered my quesiton, i did not realize having to hold 26 high through the unlocking sequence, I didnt see that in the datasheet.
Thanks,
George Manolakis