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Dear ALL,
I want to know the parameters of S25FL512SAGMFIR13, as follows:
shelf life, exposure time after unpacking during production line, baking time and temperature after damp,MSL(Moisture Sensitive Level).
型号 | 描述 | 封装 | 制造商 | shelf life | 暴露时限(小时)Exposed limited time (hrs) | Baking oven setting/烘炉设定(Tray 125℃, tape and real 40℃) | MSL等级level | 备注 | |
温度 | 烘烤时间 | ||||||||
S25FL512SAGMFIR13 | IC_NOR_Flash_Serial-SPI_3V/3.3V_512Mb_9ns_16-Pin_SOP_S25FL512SAGMFIR13 | SSOP | CYPRESS |
---|
Best Regards,
Ferris
Solved! Go to Solution.
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ENGLISH TRANSLATION WITH ANSWER :
Dear ALL,
I want to know the parameters of S25FL512SAGMFIR13, as follows:
shelf life, exposure time after unpacking during production line,
baking time and temperature after damp, MSL(Moisture Sensitive Level).
model : R1 = EHPLC, 16-pin SO pkg. with RESET# and Vi/o
description : IC FLASH, Serial NOR (SPI) 2.7V to 3.6V, 512Mb, 16-pin SO (300-mil)
manufacturer : Cypress Semiconductor
Package : 16-pin SOIC (300-mil) package.
Shelf life : One year
Exposure time limit (hours) Exposed limited time (hrs) : 168-HRS OUT-OF-BAG TIME
Baking oven setting/ oven setting (Tray 125°C, tape and real 40°C) : Oven setting is +125C - Device carrier must withstand high temperature, such as a metal tube or bakable tray; Bakable Tray must withstand (+125C) High Temperature; Temperature setting
for Tape and Reel (Oven Bake) may not be applicable. Please verify and confirm that Tape and reel material can withstand (+125C)
high temperature.
MSL level : MSL = 3 for 16-pin SO (300-mil) package (168-hrs out-of-bag time)--
Remarks
temperature : I = Industrial temp grade = -40C to +85C
Baking time : Bake time is 3 to 6 hours to remove any moisture prior to packing / Baking of the product is required if (1) the out-of-bag
time from initial exposure to board mounting is exceeded; (2) the out-of-bag product has been stored at an RH of 10% or greater; or (3)
the humidity indicator card is greater than 10%.
Hope this helps...
Best regards,
Albert
Cypress Semiconductor
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ENGLISH TRANSLATION WITH ANSWER :
Dear ALL,
I want to know the parameters of S25FL512SAGMFIR13, as follows:
shelf life, exposure time after unpacking during production line,
baking time and temperature after damp, MSL(Moisture Sensitive Level).
model : R1 = EHPLC, 16-pin SO pkg. with RESET# and Vi/o
description : IC FLASH, Serial NOR (SPI) 2.7V to 3.6V, 512Mb, 16-pin SO (300-mil)
manufacturer : Cypress Semiconductor
Package : 16-pin SOIC (300-mil) package.
Shelf life : One year
Exposure time limit (hours) Exposed limited time (hrs) : 168-HRS OUT-OF-BAG TIME
Baking oven setting/ oven setting (Tray 125°C, tape and real 40°C) : Oven setting is +125C - Device carrier must withstand high temperature, such as a metal tube or bakable tray; Bakable Tray must withstand (+125C) High Temperature; Temperature setting
for Tape and Reel (Oven Bake) may not be applicable. Please verify and confirm that Tape and reel material can withstand (+125C)
high temperature.
MSL level : MSL = 3 for 16-pin SO (300-mil) package (168-hrs out-of-bag time)--
Remarks
temperature : I = Industrial temp grade = -40C to +85C
Baking time : Bake time is 3 to 6 hours to remove any moisture prior to packing / Baking of the product is required if (1) the out-of-bag
time from initial exposure to board mounting is exceeded; (2) the out-of-bag product has been stored at an RH of 10% or greater; or (3)
the humidity indicator card is greater than 10%.
Hope this helps...
Best regards,
Albert
Cypress Semiconductor
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Dear Albert,
Thank you for providing the requested information.
I truly appreciate it,your help in resolving the problem.
Best Regards,
Ferris