Hello Mike,
A special attention must be given when handling the dual-die S70GL02GS device. The reason for this is that the commands must be addressed to every die separately (specially the unlock commands: 0x555/0xaa & 0x2AA/0x55) otherwise the commands may not work.
That's why this chip needs to be treated as two separate devices although they're sitting under the same CS#.
So probing the device should be done in two steps, that's why the need for two device entries in the device tree.
These two devices will be located in two consecutive mapped addresses and you will have to run your probing function on these two mapped addresses, of 1Gb each.
You can then chose to use the mtd-concat feature to concatenate your two mtd devices and make them look like one.
Unfortunately, I don't have any linux based example for this chip.
I hope it's clear enough now. Thanks!
Best regards,
Bacem
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Bacem Daassi
Cypress Semiconductor Corp.
Customer Application Engineering
