Footprint information CYRS16B512

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cross mob
osch
Level 1
Level 1
5 sign-ins First reply posted First question asked

Hey,

We are using CYRS16B512 in a design and because there is no footprint recommendation in the datasheet it is not clear if the pins come pre-bent or we need to mill out under the chip as the mechanical drawings are showing straight legs. Also many other ceramic packages have heatsink exposed pads, does this one? Hope someone can shed some light on this, i have not been able to find info about this in the datasheet

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BushraH_91
Moderator
Moderator
Moderator
750 replies posted 50 likes received 250 solutions authored

Hello,

No paddle on the bottom side that needs to be connected.  

This is a standard 36LD Flat Pack package which does not have an exposed pad on the bottom of the package.

Thank you

Regards,

Bushra

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