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Recommended PCB Land Pattern for Cypress nvSRAM Packages

Anonymous
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Recommended PCB Land Pattern for Cypress nvSRAM Packages

Version: **

Translation - Japanese: Cypress nvSRAMパッケージの推奨PCBランドパターンについて- Community Translated (JA)

Question:

Does Cypress provide land patterns for all the nvSRAM device packages?

Answer:

Land pattern for the following nvSRAM packages are provided as guidelines for board layout purpose.

1. 8 Lead Small Outline Integrated Circuit (8-SOIC)

2. 16 Lead Small Outline Integrated Circuit (16-SOIC)

3. 32 Lead Small Outline Integrated Circuit (32-SOIC)

4. 44 Lead Thin Small Outline Package Type II (44-TSOP II)

5. 48 Lead SSOP Shrink Small Outline Packge (48-SSOP)

6. 48 Lead Thin Small Outline Package Type I (48-TSOP I)

7. 48 Ball Fine-pitch Ball Grid Array (48-FBGA)

8. 54 Lead Thin Small Outline Package Type II (54-TSOP II)

9. 165 Ball Fine-pitch Ball Grid Array (165-FBGA)

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Revision #:
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Last update:
‎Oct 03, 2011 12:32 AM
Updated by:
Anonymous
 
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