Recommended PCB Land Pattern for Cypress nvSRAM Packages
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Version: **
Translation - Japanese: Cypress nvSRAMパッケージの推奨PCBランドパターンについて- Community Translated (JA)
Question:
Does Cypress provide land patterns for all the nvSRAM device packages?
Answer:
Land pattern for the following nvSRAM packages are provided as guidelines for board layout purpose.
1. 8 Lead Small Outline Integrated Circuit (8-SOIC)
2. 16 Lead Small Outline Integrated Circuit (16-SOIC)
3. 32 Lead Small Outline Integrated Circuit (32-SOIC)
4. 44 Lead Thin Small Outline Package Type II (44-TSOP II)
5. 48 Lead SSOP Shrink Small Outline Packge (48-SSOP)
6. 48 Lead Thin Small Outline Package Type I (48-TSOP I)
7. 48 Ball Fine-pitch Ball Grid Array (48-FBGA)
8. 54 Lead Thin Small Outline Package Type II (54-TSOP II)
9. 165 Ball Fine-pitch Ball Grid Array (165-FBGA)
- Tags:
- 1 mb quad spi nvsram
- 16mb nvsram- replacement for battery-backed sram and mram
- nonvolatile ram
- nvsram parallel
- nvsram serial
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