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What are the differences in reflow/assembly process required by Pb-Free devices?
There are requirements and conditions for the Pb-Free devices reflow process and are tabulated in the Cypress Pb-Free reflow profile shown below. The product must meet two stringent requirements, zero lead and high temperature (260 ?C) reflow capability. Higher temperature reflow capability is needed because Pb-Free solder pastes melt at higher temperatures. The Pb-Free devices are marked with an 'X' on the package in the standard parts number.
For leadframe-based packages, Nickel Palladium Gold (Ni-Pd-Au) and Matte Tin (Sn) are the primary options. Nickel Palladium Gold (Ni-Pd-Au) for internally manufactured product and Tin (Sn) for subcontract manufactured products.
BGA packages will use Tin-Silver-Copper (SnAgCu) instead of Tin-Lead (SnPb) balls