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Land Pattern Recommendations for Commonly Used Cypress Packages – KBA225416

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Land Pattern Recommendations for Commonly Used Cypress Packages – KBA225416

Author: PradiptaB_11           Version: *A

Translation - Japanese: Land Pattern Recommendations for Commonly Used Cypress Packages – KBA225416- Community Translated (J...

Question:
What are the Land Pattern recommendations for commonly used Cypress packages?

Answer:
The following are some of the commonly used Cypress packages:

100-Ball Ball Grid Array (6.0 × 6.0 × 1.0 mm)

100 Ball BGA

44-Pin Thin Small Outline Package Type II

44 Pin TSOP II

54-Pin Thin Small Outline Package Type II

54 Pin TSOP II

48-Pin Thin Small Outline Package Type I

48 Pin TSOP I

28-Pin Thin Small Outline Package

28 Pin TSOP

64-Ball Fortified Ball Grid Array (13 x 11 mm)

64 Ball FBGA 13x11

8-Pin Small Outline Integrated Circuit (208 mils)

8 Pin SOIC 208 mils

8-Pin Dual Flat No Leads (5x6x0.75 mm)

8 Pin DFN

8-Pin Ultra-Thin Small Outline No-lead Package

8 Pin USON

64-Ball Fortified Ball Grid Array (9x9mm)

64 Ball FBGA 9x9

16-Pin Quad Flat No-Leads (3 x 3 x 0.6 mm)

16 Pin QFN

8-Pin Small Outline Integrated Circuit (150 mils)

8 Pin SOIC 150 mils

100-Pin Thin Quad Flat Package (14 x 14 x 1.4 mm)

6-pin Ceramic LCC (5 x 3.2 x 1.30 mm)

8-pin Quad Flat No-Leads (3.28 x 3.28 x 0.55 mm)

16-pin Small Outline Integrated Circuit

24-pin Quad Flat No-Leads

32-Pin Thin Small Outline Package Type II

32-Pin Thin Small Outline Package Type I

48-pin Quad Flat No-Leads

48-Ball Very Fine Pitch Ball Grid Array

361-Ball Flip Chip Ball Grid Array

100 Pin TQFP

6 pin LCC

8 pin GQFN

16 pin SOIC

24 pin QFN

32 pin TSOP II

32 pin TSOP I

48 pin QFN

48 Ball VFBGA

361 Ball FCBGA

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Last update:
‎Jan 18, 2019 08:17 AM
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