Strictly necessary cookies are on by default and cannot be turned off. Functional, Performance and Tracking/targeting/sharing cookies can be turned on below based on your preferences (this banner will remain available for you to accept cookies). You may change your cookie settings by deleting cookies from your browser. Then this banner will appear again. You can learn more details about cookies HERE.
Strictly necessary (always on)
Functional, Performance and Tracking/targeting/sharing (default off)
Calculate SMD and NSMD pad dimensions for BGA package - KBA233772
Consider the following table to calculate the dimensions for SMD and NSMD pad types when designing hardware with BGA package FAB024 for optimum board-level reliability. See Figure 1.
Solder mask defined (SMD) pad type
Non-solder mask defined (NSMD) pad type
Solder mask opening = min. Solder ball size (1:1)
These values should be such that PCB metal pad (Ball land pad) > Solder ball size > Solder mask opening
Solder mask opening = (Solder ball diameter x (0.8 ~ 1.0)) + 0.15 mm
The values should be such that PCB metal pad (Ball land pad) < Solder ball size < Solder mask opening
For NSMD, solder mask opening is 0.15 mm larger than solder pad to secure enough space for excess solder.
Note: These values depend on the designer’s decision on the solder ball diameter size when processing; note that these are only recommendations. Take into account the BGA pad pitch to make sure that the solder balls are clearly apart from each other to prevent short circuits.