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The BGA package has two flash memory chips, one is on the back side with missing pins, and the other is a chip broken from the middle. The die is located on the upper chip and the pins are located on the lower chip. I want to know whether such a chip can read internal data?
In the picture, the upper one is the BGA pin damaged, the lower one is the flash memory split into two
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Memory Hyper Flash
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Hello,
Both devices are damaged beyond repair. We will not be able to read out the device content.
Thank you
Regards,
Bushra
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Hello,
Thank you for contacting Cypress Technical Support, an Infineon Technologies company. Can you please provide the full MPN?
Regards,
Bushra
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Hello,
Both devices are damaged beyond repair. We will not be able to read out the device content.
Thank you
Regards,
Bushra