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Hi,
On the CY8C4146FNI-S433T (PSoC 4 in 35-Ball WLCSP Package) there is a cover/coating. During the assembly process of our printed circuit assembly, this cover is sometimes damaged. This cover/coating appears to only contain the device markings such as pin 1 location and part number.
Does this coating serve any purpose other than identification? And if it is damaged during the assembly process, is it going to affect the performance of the device?
What is the best way to prevent damage to this coating? It seems quite sensitive to heat and pressure when the assembly is being thoroughly cleaned.
Thank you.
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Hi,
Can you please attach a HD image showing the damage of the cover to understand the actual scenario?
Thanks
Ganesh
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Hi Ganesh,
The bottom left corner has a small "chip" in the cover/coating.
Thank you.
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Hi JaSc_4288446,
Thanks for attaching the image. As discussed internally with the team, the main purpose of the backside laminate tape is for better marking quality and minimizing backside chipping.
>>What is the best way to prevent damage to this coating? It seems quite sensitive to heat and pressure when the assembly is being thoroughly cleaned?
-> Can you please let us know the range of temperature and pressure you are opting for ? Also, can you briefly explain the process you are following?
Best Regards,
Aashita