S25FL-S device capacity, pkg options and reliability

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PhPu_4560846
Level 1
Level 1

Latest info show S25FL-S supporting 512Mb and 1Gb capacity. That's great.

  • Are both new devices 100% compatible to the earlier 128/256Mb devices in terms of command, function and compatible with Xilinx ZYNQ 7000 drivers?
  • How are the die arranged in the 512Mb and 1Gb in the package?
  • Are they equally reliable in terms die mechanical and thermal reliability?
  • Can these devices come in WSON package same as S25FL256SAGNFM000 so we can upgrade our board?
  • How do I order samples w/ WSON pkg?
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1 Solution
Apurva_S
Moderator
Moderator
Moderator
100 likes received 500 replies posted 250 solutions authored

Hi,

Thank you for contacting Cypress Community.

Are both new devices 100% compatible to the earlier 128/256Mb devices in terms of command, function and compatible with Xilinx ZYNQ 7000 drivers?

Yes, 512Mb and 1Gb devices are 100% compatible with 256/128Mb devices in terms of command and funct...

How are the die arranged in the 512Mb and 1Gb in the package?

I'm sorry I didn't understand your question. Can you please elaborate?

Are they equally reliable in terms die mechanical and thermal reliability?

Checking on this internally.

Can these devices come in WSON package same as S25FL256SAGNFM000 so we can upgrade our board?

Unfortunately, 512Mb/1Gb parts are not available in WSON package. You can check the available packa...S25FL512S, S70FL01GS.

Thank you and Regards,

Apurva

View solution in original post

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3 Replies
Apurva_S
Moderator
Moderator
Moderator
100 likes received 500 replies posted 250 solutions authored

Hi,

Thank you for contacting Cypress Community.

Are both new devices 100% compatible to the earlier 128/256Mb devices in terms of command, function and compatible with Xilinx ZYNQ 7000 drivers?

Yes, 512Mb and 1Gb devices are 100% compatible with 256/128Mb devices in terms of command and funct...

How are the die arranged in the 512Mb and 1Gb in the package?

I'm sorry I didn't understand your question. Can you please elaborate?

Are they equally reliable in terms die mechanical and thermal reliability?

Checking on this internally.

Can these devices come in WSON package same as S25FL256SAGNFM000 so we can upgrade our board?

Unfortunately, 512Mb/1Gb parts are not available in WSON package. You can check the available packa...S25FL512S, S70FL01GS.

Thank you and Regards,

Apurva

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  • The dual stack die arrangement answered my question.
  • Please share feedback on reliability when available

Thank you Apurva.

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Hi,

Apologies for the delay.

You can refer to one of the MCP report (002-21614) for the reliability test performed on MCP package.

Typically, we perform qualification separately for MCP package due to different construction.

Let me know if this answers your question or you need more information.

Thank you and Regards,

Apurva

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