AN201106 recomendations in FAQ

[RoSt_2270521]

Last time buy of Pb free (NiPdAu) lead frame devices five years in, we are seeing difficulty wetting. Once long term storage of packaged devices start to have lead not wetting what recommendations does Cypress recommend to improve wetting? The FAQ recommends solderability but not a solution or recommendations on improving wetting.

[Roy_Liu]

Is this What are the basic storage and/or baking instructions for packages with an MSL of 3? - KBA203617  what you are looking for?

[RoSt_2270521]

YuxianL_01 ;

No, the issue is with soldering the Ni Pd Au , there are no issues with bake out, the coupons cards as I know are not showing moisture. I have made a request to the assembly team to confirm but moisture ingress was not reported into the packaging.

Moisture would cause issues with the device package when soldered. This is strictly a wetting issue with the NiPdAu lead finish.

Bobby Stacey

Senior Test Engineer, Design Support Team

BAE Systems Electronic Systems, Controls & Avionics Solutions

T: 260.434.5424 | M: 260.579.3067 | E: bobby.stacey@baesystems.com<mailto:bobby.stacey@baesystems.com>

4250 Airport Expy., Fort Wayne, Indiana 46809 United States

Connect with BAE Systems: <https://www.facebook.com/BAESystemsplc> <https://twitter.com/baesystemsplc> <https://www.linkedin.com/company/bae-systems> <https://www.youtube.com/user/BAESystemsplc>

[Hari]

Hi RoSt_2270521

How many units have this problem? What is the total units they tested?

For other Cypress devices with NiPdAu issue, what is the date code of this lot?

Thanks,
Hari