Pad pitch of CYBT-343026-01 and CYBT-353027-02

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KeTa_1341526
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Distributor - TED (Japan)
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Hello,

Pad pitch is defined in the datasheets of CYBT-343026-01 and CYBT-353027-02.

- CYBT-343026-01

       Datasheet: https://www.cypress.com/file/381006/download

       Page.6: Table 2 [Pad Pitch] 1.22mm

- CYBT-353027-02

       Datasheet: https://www.cypress.com/file/416356/download

       Page.6: Table 2 [Pad Pitch] 1.05mm

However, in [Table 3. Module Solder Pad Location] of each data sheet, the pitch of the following pad is different from the value defined above.

- CYBT-343026-01

       Page.8: Table 3. Module Solder Pad Location

              Pad 7 - Pad 6 = 12.35mm - 11.14mm = 1.21mm

              Pad 18 - Pad 19 = 12.35mm - 11.14mm = 1.21mm

- CYBT-353027-02

       Page.8: Table 3. Module Solder Pad Location

              Pad 8 - Pad 7 = 1.88mm - 0.82mm = 1.06mm

Is this a problem?

When designing a solder pad, should I design it according to [Table 3. Module Solder Pad Location]?

Best regards,

Kenji Takahashi

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1 Solution
Owen_Zhang123
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The difference is caused by the transfer from mil to mm.

The actual value for CYBT-343026 is 48mil.

The actual value for CYBT-353027 is 41.34mil.

You can refer to the module package in the Kit board:

https://www.cypress.com/documentation/development-kitsboards/cybt-353027-eval-ez-bt-module-arduino-e...

https://www.cypress.com/documentation/development-kitsboards/cybt-343026-eval-ez-bt-module-arduino-e...

View solution in original post

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Owen_Zhang123
Moderator
Moderator
Moderator
5 questions asked 500 solutions authored 250 sign-ins

The difference is caused by the transfer from mil to mm.

The actual value for CYBT-343026 is 48mil.

The actual value for CYBT-353027 is 41.34mil.

You can refer to the module package in the Kit board:

https://www.cypress.com/documentation/development-kitsboards/cybt-353027-eval-ez-bt-module-arduino-e...

https://www.cypress.com/documentation/development-kitsboards/cybt-343026-eval-ez-bt-module-arduino-e...

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