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Hello,
Pad pitch is defined in the datasheets of CYBT-343026-01 and CYBT-353027-02.
- CYBT-343026-01
Datasheet: https://www.cypress.com/file/381006/download
Page.6: Table 2 [Pad Pitch] 1.22mm
- CYBT-353027-02
Datasheet: https://www.cypress.com/file/416356/download
Page.6: Table 2 [Pad Pitch] 1.05mm
However, in [Table 3. Module Solder Pad Location] of each data sheet, the pitch of the following pad is different from the value defined above.
- CYBT-343026-01
Page.8: Table 3. Module Solder Pad Location
Pad 7 - Pad 6 = 12.35mm - 11.14mm = 1.21mm
Pad 18 - Pad 19 = 12.35mm - 11.14mm = 1.21mm
- CYBT-353027-02
Page.8: Table 3. Module Solder Pad Location
Pad 8 - Pad 7 = 1.88mm - 0.82mm = 1.06mm
Is this a problem?
When designing a solder pad, should I design it according to [Table 3. Module Solder Pad Location]?
Best regards,
Kenji Takahashi
Solved! Go to Solution.
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The difference is caused by the transfer from mil to mm.
The actual value for CYBT-343026 is 48mil.
The actual value for CYBT-353027 is 41.34mil.
You can refer to the module package in the Kit board:
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The difference is caused by the transfer from mil to mm.
The actual value for CYBT-343026 is 48mil.
The actual value for CYBT-353027 is 41.34mil.
You can refer to the module package in the Kit board: