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I am looking for the Junction-to-Board resistance, Junction-to-Case resistance, Max Junction Temperature, and Max Power Dissipated for S25FL064LABMFI010 SOIC8 package. I have only been able to locate the Junction-to-Ambient resistance in the data sheet. Thanks.
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Hi Juan Brown,
Please see the maximum junction temperature and power dissipation information below.
Maximum junction temperature: 90.9 °C
Maximum power dissipation: VCC(max) * ICC (max) = 3.6V * 25mA = 90mW. (SDR operation at 108MHz)
Thanks and Regards,
Sudheesh
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Hi Juan Brown,
We do not provide Theta JB and Theta JC thermal resistance values for our flash devices. Instead, we can provide the parameter "Psi JT" (thermal characterization parameter from device junction to package top). Refer our application note available at: https://www.cypress.com/file/210756/download for more details about the usage of Psi JT. Please feel free to ask if you have any other related queries.
Psi JT for S25FL064L (SOIC8) = 1 °C/W
Thanks and Regards,
Sudheesh
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Thanks for the reply! Is there any information on the max junction temperature and max power dissipation?
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Hi Juan Brown,
Please see the maximum junction temperature and power dissipation information below.
Maximum junction temperature: 90.9 °C
Maximum power dissipation: VCC(max) * ICC (max) = 3.6V * 25mA = 90mW. (SDR operation at 108MHz)
Thanks and Regards,
Sudheesh