Solder Balls on 124-BGA PSoC 6 MCU

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edhi_4515126
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Hi,

I'm trying to find out if the solder balls on the package are collapsible or non-collapsible so I can properly design a land pattern.

The datasheet is Document Number: 002-18449 Rev. F.  The package description begins on Page 56 of 63.  the Package is the 124-BGA with Package Drawing 001-97718.

Thanks,

Ed

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ShipingW_81
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500 replies posted 250 solutions authored 250 replies posted

I tend to believe the solder balls on that package is non-collapsible.

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ShipingW_81
Moderator
Moderator
Moderator
500 replies posted 250 solutions authored 250 replies posted

I tend to believe the solder balls on that package is non-collapsible.

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