Thank you for contacting Cypress Semiconductor
The meaning of the "706FF309 C C05 Spansion" are as follows :
"7" = 2017 production year
"06" = Workweek tf when the device was packaged within 2017 production year
"F" = Package Assembly Location (Japan)
"F" = Mark and Pack Location (Japan)
"306" = 306th wafer lot sequence within the workweek 06
"C" = For Cypress Internal Tracking Purposes only; Transparent to the end user.
"05" = 2005 is the year the circuitry was Copyrighted
"Spansion" = the S29GL128P10TFI01 was originally design and manufactured by Spansion.
Cypress acquired Spansion in March, 2015.
Hope this helps...
Thank you very much for your wonderful answer, but I have another questions to ask.
Sum up. Faulty flash chip surface label are S29GL128P10TF101 706FF309C @05 SPANSION and S29GL128P10TF101
722FF163C @05 SPANSION, and the total number is 18pcs. Have you ever received any feedback about the problems in these two batches before? Or is there a problem with these two batches in the production process?
Below picture one is the power-on waveform of VIO and VCC. Below picture two is the power-down waveform of VIO and VCC. VCC and VIO are connected together. The voltage amplitude is 3.3V. Thank you !
Accelink company, China