Anonymous
Not applicable
Jul 23, 2018
09:34 AM
- Mark as New
- Bookmark
- Subscribe
- Mute
- Subscribe to RSS Feed
- Permalink
- Report Inappropriate Content
Jul 23, 2018
09:34 AM
The CYUSB3035 documentation says for symbol design use 9.5mil diameter pads on a 0.8mm pitch BGA package. Pad size seems very small for the package. Is this correct? If not what diameter pad size should I use?
Solved! Go to Solution.
Labels
1 Solution
Jul 23, 2018
10:34 AM
- Mark as New
- Bookmark
- Subscribe
- Mute
- Subscribe to RSS Feed
- Permalink
- Report Inappropriate Content
Jul 23, 2018
10:34 AM
Hi Don Hall,
It's correct, We recommended pad size is 0.241 mm (9.5 mil).
Regards,
Anil Srinivas.
1 Reply
Jul 23, 2018
10:34 AM
- Mark as New
- Bookmark
- Subscribe
- Mute
- Subscribe to RSS Feed
- Permalink
- Report Inappropriate Content
Jul 23, 2018
10:34 AM
Hi Don Hall,
It's correct, We recommended pad size is 0.241 mm (9.5 mil).
Regards,
Anil Srinivas.