1 Reply Latest reply on Jun 11, 2018 8:20 AM by SudheeshK_26

    Using a single footprint for both FAB024 and FAC024

      Hi everybody,


      We are designing a board with the S25FL256L device. Reading through the datasheet we saw note (4) on page 6.

      The notes states that we can use a single footprint for both the FAB024 and the FAC024 BGA package types.


      The problem is that the location of the A1 balls in the two package types have different shifts from the edge.

      This forces us to design a bigger keep out zone, and set a different shift for each device we use, something we are looking to avoid...


      How do we go about designing a single footprint for both devices?

      Did anybody else encounter this issue?



      Thanks in advance,

      Yan Rosh