Alternate NOR Flash for S70GL02GS11FHI010

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cross mob
Anonymous
Not applicable

Hi,

Can we use S70GL02GS11FHI020 as a drop-in replacement for the S70GL02GS11FHI010?

The only difference I see is xxxx10 has highest address sector is protected and xxxx20 has lowest one protected. If we are not protecting any sector for our application then do we need to worry about using either one?

Also if we are looking to use S70GL02GT11FHI010, which has same characteristics as the GS part based on the data sheet except the GS part is dual die package and GT is not.

Does this matter to the u-boot and Linux driver?

Appreciate your response.

Thanks.

Regards,

Raj.

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1 Solution
VincentH_06
Employee
Employee
10 replies posted 5 replies posted First solution authored

Hi Raj,

The difference between S70GL02GS11FHI020 and S70GL02GS11FHI010 is only the protection area, one is high address while the other is low address, if you are not using the protection functions, there are not different between there 2 parts.

GT grade is our highest reliability and quality level specially designed for automobile applications, if you are using in the normal application , the industry level part number is enough.

Another difference between GL and GS is GL using 3.3V Vcc while GS using 1.8V Vcc, the PCB design is different. The dual-die package need 2 CS# pin to select these 2 parts, but one die package only have 1 CS# pin.

Thank you!

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2 Replies
VincentH_06
Employee
Employee
10 replies posted 5 replies posted First solution authored

Hi Raj,

The difference between S70GL02GS11FHI020 and S70GL02GS11FHI010 is only the protection area, one is high address while the other is low address, if you are not using the protection functions, there are not different between there 2 parts.

GT grade is our highest reliability and quality level specially designed for automobile applications, if you are using in the normal application , the industry level part number is enough.

Another difference between GL and GS is GL using 3.3V Vcc while GS using 1.8V Vcc, the PCB design is different. The dual-die package need 2 CS# pin to select these 2 parts, but one die package only have 1 CS# pin.

Thank you!

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DaWi_3430881
Level 3
Level 3
First like given

The part about the dual-die device needs two #CS/#CE pins in not correct. Externally there is only one #CE pin. Internally the #CE pin is connected to both dies. The die selection is the highest bit of the address bus.

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